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Director, Advanced Product Development (26730)

Company: Amkor Technology Inc
Location: Tempe
Posted on: June 6, 2021

Job Description:

Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com.

Position Summary:

Amkor is seeking an engineer with experience in IC package development, with an emphasis on System-In-Package (SiP) technologies. This position requires managing the product development from inception through final product qualification and production launch. This position is based out of the Amkor corporate office in Tempe, AZ.

Essential Duties and Responsibilities:

  • Manage advanced semiconductor package development programs, interfacing directly with stakeholders in R&D, business units, factories, sales/marketing, and end customers
  • Remain abreast of advanced semiconductor packaging trends, road maps, materials, equipment, customer requirements, and competitive threats
  • Ensure processes, materials, and packages that are developed meet all financial and quality metrics set forth by corporate directives
  • Continuously communicate with all stakeholders within all managed programs, including customers, business unit, and factory personnel
  • Regularly update upper management to report program progress, highlight cost, schedule, and technical gaps, and suggest viable solutions to any program deficiencies

Required Qualifications:

  • A minimum of 10 years experience in the semiconductor industry
  • A minimum of 5 years experience in advanced IC packaging technologies; prior experience in System-in-Package (SiP) assembly technology is a plus
  • Bachelor's degree in science or engineering
  • Must have the proven ability to be self-motivating and to achieve aggressive technical, cost, and schedule goals
  • Must have a strong track record of working successfully in cross functional development teams

Preferred Qualifications:

  • Hands-on experience in advanced packaging, including SiP, flip chip, MEMS/Sensor and wafer-level packaging
  • Surface Mount Technology (SMT) experience is a plus
  • Experience with the Outsource Assembly and Test (OSAT) industry
  • A history of and a command for public speaking (internal and external to the company)
  • Master's degree in science or engineering
  • Project Management Professional (PMP) certification
  • Familiarity with Advanced Product Quality Planning (APQP), Product Life Management (PLM) software and JMP software (or other statistical analysis tools), and a basic understanding of Finite Element Modeling (FEM)

Location:

Tempe, AZ

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

Keywords: Amkor Technology Inc, Tempe , Director, Advanced Product Development (26730), Other , Tempe, Arizona

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