Director, Wafer Services Business Unit

Company: Amkor Technology
Location: Tempe
Posted on: February 25, 2021

Job Description:

Career Opportunities: Director, Wafer Services Business Unit (26738) Requisition ID--26738-----Posted--02/19/2021-----Product Management-----Full-Time Amkor Technology, Inc. is one of the world's largest providers of outsourced semiconductor packaging and test services. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test and is now a strategic manufacturing partner for the world's leading semiconductor companies, foundries and electronics OEMs. Amkor's operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the USA. For more information, visit www.amkor.com . Position Summary Amkor is recruiting for a Director, Wafer Services Product in Tempe, AZ. This position will be a customer facing role with significant customer interaction on a day-to-day basis. This position includes cross functional management and direct customer interactions for new product development, qualification and mass production of wafer bumping, wafer level CSP, wafer level fan out, and die processing. The position will include technical, capacity, CapEx, and commercial discussions. Daily interaction with Amkor Sales team and Factory teams will be needed to manage customer expectations and requirements. Essential Duties and Responsibilities This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill. The selected individual will need to help define and concurrently manage ownership of multiple programs, from both business and technical sides.

--- Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the package portfolio with key customers to gain business; travel to Amkor factories and customer locations as needed
--- Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them
--- Work closely with customer package engineering and Amkor factory engineering to understand / characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps; this will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution
--- Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs
--- Work with Amkor advanced product development teams on the transfer of new packaging technologies to production; this will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp
--- Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets
--- This position will have capacity and planning discussions with customers
--- Perform technical deep dives in WLCSP and Wafer Level Processes (Wafer bumping, CuP, WLFO, Lead Free, Probe, Die Processing, etc.)
--- Being collaborative and having an optimistic, can-do attitude on a daily basis is essential Required Qualifications --- Bachelor's Degree in Engineering with minimum of 10 years' experience in semiconductor manufacturing or packaging
--- Exhibit organized technical Project Management experience (preferably, involving off-shore factories) and the ability to multiplex across numerous programs and teams is essential
--- Demonstrated ability to work independently in a heavily matrixed organization; needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role; assuming ownership of program success is a must
--- Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various wafer bumping
--- Requires excellent written and verbal communication skills
--- Frequent face to face and teleconference technical presentations to customers is required
--- Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
--- This position requires approximately 15% domestic and 15% international travel Preferred Qualifications --- Hands on semiconductor manufacturing / technical experience is highly desired
--- Experience with cost modeling, pricing, quoting, and negotiating activities and products would be beneficial
--- Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures is desired
--- Direct wafer level packaging (WLP) experience including wafer bumping and die processing is desired Location: Tempe, AZ Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.

Keywords: Amkor Technology, Tempe , Director, Wafer Services Business Unit, Executive , Tempe, Arizona