Director, Wafer Services Business Unit
Company: Amkor Technology
Location: Tempe
Posted on: February 25, 2021
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Job Description:
Career Opportunities: Director, Wafer Services Business Unit
(26738) Requisition ID--26738-----Posted--02/19/2021-----Product
Management-----Full-Time Amkor Technology, Inc. is one of the
world's largest providers of outsourced semiconductor packaging and
test services. Founded in 1968, Amkor pioneered the outsourcing of
IC packaging and test and is now a strategic manufacturing partner
for the world's leading semiconductor companies, foundries and
electronics OEMs. Amkor's operational base includes production
facilities, product development centers and sales and support
offices located in key electronics manufacturing regions in Asia,
Europe and the USA. For more information, visit www.amkor.com .
Position Summary Amkor is recruiting for a Director, Wafer Services
Product in Tempe, AZ. This position will be a customer facing role
with significant customer interaction on a day-to-day basis. This
position includes cross functional management and direct customer
interactions for new product development, qualification and mass
production of wafer bumping, wafer level CSP, wafer level fan out,
and die processing. The position will include technical, capacity,
CapEx, and commercial discussions. Daily interaction with Amkor
Sales team and Factory teams will be needed to manage customer
expectations and requirements. Essential Duties and
Responsibilities This role combines deep technical knowledge,
project management, strategic planning, tactical execution,
customer satisfaction control, business sense, and negotiation
skill. The selected individual will need to help define and
concurrently manage ownership of multiple programs, from both
business and technical sides.
--- Promote Amkor package technologies directly to new and existing
customers to find potential applications, deploying the package
portfolio with key customers to gain business; travel to Amkor
factories and customer locations as needed
--- Create detailed package/process risk assessments for the
manufacturability and reliability of NPIs, including highlighting
areas of customer requirements that drive cost and implementing
mitigation plans to control them
--- Work closely with customer package engineering and Amkor
factory engineering to understand / characterize prototype build
plans; enabling successful qualifications and robust, on-time
manufacturing production ramps; this will include assisting the
team in designing experiments, analyzing factory build data,
supporting root cause failure analysis investigation, and managing
corrective action pathways to resolution
--- Create and maintain detailed cost analysis on package types,
process flows, and customer product RFQs as well as provide
detailed pricing inputs to Management and Sales on customer package
engineering programs
--- Work with Amkor advanced product development teams on the
transfer of new packaging technologies to production; this will
include supporting cost analysis, CapEx requirements,
manufacturability assessments, and program management through final
qualification and initial production ramp
--- Work within the team to foster the development of product
roadmaps, marketing strategies and business plans for continued
growth in both existing and emerging markets
--- This position will have capacity and planning discussions with
customers
--- Perform technical deep dives in WLCSP and Wafer Level Processes
(Wafer bumping, CuP, WLFO, Lead Free, Probe, Die Processing,
etc.)
--- Being collaborative and having an optimistic, can-do attitude
on a daily basis is essential Required Qualifications ---
Bachelor's Degree in Engineering with minimum of 10 years'
experience in semiconductor manufacturing or packaging
--- Exhibit organized technical Project Management experience
(preferably, involving off-shore factories) and the ability to
multiplex across numerous programs and teams is essential
--- Demonstrated ability to work independently in a heavily
matrixed organization; needs to be self-driven and very motivated
to adapt and overcome obstacles across a multi-faceted job role;
assuming ownership of program success is a must
--- Solid knowledge of semiconductor packaging design, materials,
substrates, manufacturing methods and various wafer bumping
--- Requires excellent written and verbal communication skills
--- Frequent face to face and teleconference technical
presentations to customers is required
--- Proficiency with Microsoft Office (Excel, PowerPoint, Outlook)
is required
--- This position requires approximately 15% domestic and 15%
international travel Preferred Qualifications --- Hands on
semiconductor manufacturing / technical experience is highly
desired
--- Experience with cost modeling, pricing, quoting, and
negotiating activities and products would be beneficial
--- Knowledge of material and package characterization data
analysis, reliability test methods and qualification procedures is
desired
--- Direct wafer level packaging (WLP) experience including wafer
bumping and die processing is desired Location: Tempe, AZ Amkor is
proud to be an Equal Opportunity Employer. We do not discriminate
on the basis of race, color, ancestry, national origin, religion or
religious creed, mental or physical disability, medical condition,
genetic information, sex (including pregnancy, childbirth, and
related medical conditions), sexual orientation, gender identity,
gender expression, age, marital status, military or veteran status,
citizenship, or other characteristics protected by state or federal
law or local ordinance.
Keywords: Amkor Technology, Tempe , Director, Wafer Services Business Unit, Executive , Tempe, Arizona
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